IEC 61760-1:2006 Withdrawn
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
|Publication type||International Standard|
|Available language(s)||English, English/French|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.240 - Mechanical structures for electronic equipment|
|File size||1290 KB|
The following test report forms are related:
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