IEC 61760-1:2006 

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

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Abstract

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

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Additional information

Publication typeInternational Standard
Publication date2006-04-10
Edition2.0
Available language(s)English, English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.240 - Mechanical structures for electronic equipment
Stability date  2019
Pages60
File size1240 KB

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