IEC 61760-1:2006 Withdrawn

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)


Do you need a multi-user copy?




IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

Look inside

Additional information

Publication typeInternational Standard
Publication date2006-04-10
Available language(s)English, English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.240 - Mechanical structures for electronic equipment
Stability date  2020
File size1290 KB

The following test report forms are related:

Share this page

Share your publications

Learn how to share your publications with your colleagues, using networking options.

Payment information

Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa), PayPal and bank transfers as form of payment.

Keep in touch

Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.

Contact customer services

Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.