IEC 61760-2:2007 

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

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Abstract

IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.

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Additional information

Publication typeInternational Standard
Publication date2007-04-24
Edition2.0
Available language(s)English, English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.240 - Mechanical structures for electronic equipment
Stability date  2020
Pages17
File size895 KB

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