IEC 61760-4:2015/AMD1:2018 

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Note: a consolidated version of this publication exists
IEC 61760-4:2015+AMD1:2018 CSV


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Additional information

Publication typeInternational Standard
Publication date2018-03-13
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2022
File size988 KB

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