IEC 60749-12:2017
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
Abstract
IEC 60749-12:2017 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages
This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) alignment with MIL-STD-883J Method 2007, Vibration, variable frequency.
This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) alignment with MIL-STD-883J Method 2007, Vibration, variable frequency.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2017-12-13 |
Edition | 2.0 |
Available language(s) | English/French |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2029 |
Pages | 14 |
File size | 1034 KB |
The following test report forms are related:
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