IEC 62899-202-7:2021 

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method


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IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

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Additional information

Publication typeInternational Standard
Publication date2021-03-03
Available language(s)English
TC/SCTC 119 - Printed Electronicsrss
ICS29.035.01 - Insulating materials in general
31.180 - Printed circuits and boards
Stability date  2025
File size1019 KB

The following test report forms are related:

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