IEC 62899-202-7:2021
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
Abstract
IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2021-03-03 |
| Edition | 1.0 |
| Available language(s) | English |
| TC/SC | TC 119 - Printed Electronicsrss |
| ICS | 29.035.01 - Insulating materials in general 31.180 - Printed circuits and boards |
| Stability date | 2025 |
| Pages | 12 |
| File size | 1019 KB |
The following test report forms are related:
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