IEC 61189-2-801
IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
CHFÂ 40.-
Technical committee
TC 91 Electronics assembly technology| Publication type | International Standard |
| Publication date | 2023-07-26 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2027 |
| ISBN number | 9782832272589 |
| Pages | 21 |
| File size | 1.27 MB |
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