IEC 61189-2-803
IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
CHFÂ 20.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | International Standard |
| Publication date | 2023-07-26 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2027 |
| ISBN number | 9782832272640 |
| Pages | 16 |
| File size | 705.95 KB |
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