IEC 61189-2-804
IEC 61189-2-804:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
CHFÂ 20.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | International Standard |
| Publication date | 2023-08-25 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2027 |
| ISBN number | 9782832274224 |
| Pages | 16 |
| File size | 702.15 KB |
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