IEC 60068-2-69:2017/AMD1:2019 

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Note: a consolidated version of this publication exists
IEC 60068-2-69:2017+AMD1:2019 CSV

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Additional information

Publication typeInternational Standard
Publication date2019-06-19
Edition3.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS19.040 - Environmental testing
31.190 - Electronic component assemblies
Stability date  2026
Pages13
File size1226 KB

The following test report forms are related:



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