Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Note: a consolidated version of this publication exists
IEC 60068-2-69:2017+AMD1:2019 CSV
|Publication type||International Standard|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||19.040 - Environmental testing
31.190 - Electronic component assemblies
|File size||1226 KB|
The following test report forms are related:
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