IEC 62047-37:2020 

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

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Abstract

IEC 62047-37:2020 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.
This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

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Additional information

Publication typeInternational Standard
Publication date2020-04-28
Edition1.0
Available language(s)English/French
TC/SCTC 47/SC 47F - Micro-electromechanical systemsrss
ICS31.080.99 - Other semiconductor devices
31.140 - Piezoelectric devices
Stability date  2025
Pages34
File size1612 KB

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