IEC 62047-18:2013 

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

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Abstract

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

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Additional information

Publication typeInternational Standard
Publication date2013-07-17
Edition1.0
Available language(s)English/French
TC/SCTC 47/SC 47F - Micro-electromechanical systemsrss
ICS31.080.99 - Other semiconductor devices
Stability date  2027
Pages26
File size1465 KB

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