IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Abstract
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2013-07-17 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 47/SC 47F - Micro-electromechanical systemsrss |
ICS | 31.080.99 - Other semiconductor devices |
Stability date | 2027 |
Pages | 26 |
File size | 1465 KB |
The following test report forms are related:
Share your publications
Learn how to share your publications with your colleagues, using networking options.
Payment information
Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa, JCB and CUP), PayPal and bank transfers as form of payment.
Keep in touch
Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.
Contact customer services
Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 16:00 CET Monday to Friday.