IEC 62878-2-602
IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
CHFÂ 80.-
Technical committee
TC 91 Electronics assembly technologyCategory
Electromagnetic Compatibility - Environment| Publication type | International Standard |
| Publication date | 2021-06-22 |
| Edition | 1.0 |
| ICS | 31.180 31.190 |
| Stability date | 2026 |
| ISBN number | 9782832298947 |
| Pages | 24 |
| File size | 4.90 MB |
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