IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
Abstract
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2021-06-22 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
| Stability date | 2026 |
| Pages | 24 |
| File size | 5135 KB |
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