IEC 60691:2015+AMD1:2019 CSV Withdrawn
Thermal-links - Requirements and application guide
- requirements for thermal-link packaged assemblies;
- renew the requirements and definitions for Th-test;
- change starting temperature for interrupt current test;
- clarify requirements for marking (packing label);
- minimum Proof Tracking Index 175 instead 120.
The contents of the corrigendum of August 2016 have been included in this copy. This consolidated version consists of the fourth edition (2015) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.
Keywords: thermal protection of equipment, thermal-links
|Publication type||International Standard|
|Available language(s)||English, English/French|
|TC/SC||TC 32/SC 32C - Miniature fusesrss|
|ICS||29.120.50 - Fuses and other overcurrent protection devices|
|File size||4316 KB|
The following test report forms are related:
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