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IEC 60749-20:2020 RLV
IEC 60749-20
IEC 60749-20:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
CHFÂ 200.-
Redline version
All the changes between the new edition and previous edition of the publication are highlighted with track changes mode.
DiscoverTechnical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2020-08-31 |
| Edition | 3.0 |
| ICS | 31.080.01 |
| Stability date | 2030 |
| ISBN number | 9782832287279 |
| Pages | 55 |
| File size | 2.54 MB |
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