IEC 62137-1-1:2007 

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

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Abstract

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

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Additional information

Publication typeInternational Standard
Publication date2007-07-11
Edition1.0
Available language(s)English, English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2020
Pages30
File size1035 KB

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