IEC 62137-3:2011 

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

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Abstract

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.

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Additional information

Publication typeInternational Standard
Publication date2011-11-08
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2022
Pages90
File size2472 KB

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