IEC 62137-3:2011 

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints


Do you need a multi-user copy?




IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.

Look inside

Additional information

Publication typeInternational Standard
Publication date2011-11-08
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2022
File size2472 KB

The following test report forms are related:

Share your publications

Learn how to share your publications with your colleagues, using networking options.

Payment information

Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa), PayPal and bank transfers as form of payment.

Keep in touch

Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.

Contact customer services

Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.