IEC 60068-2-69:2017+AMD1:2019 CSV
Consolidated version
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Abstract
IEC 60068-2-69:2017+A1.2019 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition:
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
The contents of the corrigendum of January 2018 have been included in this copy. This consolidated version consists of the third edition (2017) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
The contents of the corrigendum of January 2018 have been included in this copy. This consolidated version consists of the third edition (2017) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2019-06-19 |
Edition | 3.1 |
Available language(s) | English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 19.040 - Environmental testing
31.190 - Electronic component assemblies |
Stability date | 2026 |
Pages | 226 |
File size | 3742 KB |
The following test report forms are related:
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