IEC 61189-2-501:2022 

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials


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IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

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Additional information

Publication typeInternational Standard
Publication date2022-02-03
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
Stability date  2026
File size1882 KB

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