IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Abstract
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2021-09-03 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2026 |
| Pages | 17 |
| File size | 1140 KB |
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