IEC 61188-6-2:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Abstract
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2021-02-04 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
| Stability date | 2026 |
| Pages | 49 |
| File size | 2171 KB |
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