IEC 62878-1:2019 PRV 
Pre release version

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

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Abstract

This Final Draft International Standard is an up to 6 weeks' pre-release of the official publication. It is available for sale during its voting period: 2019-08-02 to 2019-09-13. By purchasing this FDIS now, you will automatically receive, in addition, the final publication.

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

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Additional information

Publication typeInternational Standard
Publication date2019-08-02
Edition1.0
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
31.190 - Electronic component assemblies
Stability date  2025
Pages19
File size1230 KB

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