IEC 62258-6
IEC 62258-6:2006
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
CHFÂ 40.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2006-08-28 |
| Edition | 1.0 |
| ICS | 31.080.99 |
| Stability date | 2026 |
| ISBN number | 2831887860 |
| Pages | 9 |
| File size | 241.33 KB |
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