IEC TR 62878-2-8:2021
Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
|Publication type||Technical Report|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.180 - Printed circuits and boards|
31.190 - Electronic component assemblies
|File size||2555 KB|
The following test report forms are related:
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