IEC 60749-20:2020 PRV 
Pre release version

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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Abstract

This Final Draft International Standard is an up to 6 weeks' pre-release of the official publication. It is available for sale during its voting period: 2020-05-29 to 2020-07-10. By purchasing this FDIS now, you will automatically receive, in addition, the final publication.

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This edition includes the following significant technical changes with respect to the previous edition:
  1. incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
  2. inclusion of new Clause 3;
  3. inclusion of explanatory notes.

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Additional information

Publication typeInternational Standard
Publication date2020-05-29
Edition3.0
Available language(s)English
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2025
Pages27
File size1685 KB

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