IEC TR 61191-8:2021
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
|Publication type||Technical Report|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.180 - Printed circuits and boards|
31.190 - Electronic component assemblies
|File size||5381 KB|
The following test report forms are related:
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