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IEC 60749-37:2022 RLV
IEC 60749-37
IEC 60749-37:2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
CHFÂ 155.-
Redline version
All the changes between the new edition and previous edition of the publication are highlighted with track changes mode.
DiscoverTechnical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2022-10-12 |
| Edition | 2.0 |
| ICS | 31.080.01 |
| Stability date | 2026 |
| ISBN number | 9782832258378 |
| Pages | 43 |
| File size | 2.83 MB |
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