IEC 62899-202:2023
Printed electronics - Part 202: Materials - Conductive ink
Note: a redline version of this publication exists
IEC 62899-202:2023 RLV
Abstract
IEC 62899-202:2023 is available as IEC 62899-202:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.
IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.
Look inside
Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2023-05-02 |
| Edition | 2.0 |
| Available language(s) | English |
| TC/SC | TC 119 - Printed Electronicsrss |
| ICS | 31.180 - Printed circuits and boards 87.080 - Inks. Printing inks |
| Stability date | 2028 |
| Pages | 37 |
| File size | 1389 KB |
The following test report forms are related:
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