IEC TR 62878-2-9:2022
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
|Publication type||Technical Report|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.180 - Printed circuits and boards|
31.190 - Electronic component assemblies
|File size||2415 KB|
The following test report forms are related:
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