IEC 61189-2-809
IEC 61189-2-809:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
CHFÂ 40.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | International Standard |
| Publication date | 2024-12-09 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2028 |
| ISBN number | 9782832700549 |
| Pages | 17 |
| File size | 771.63 KB |
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