IEC TR 61760-3-1:2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
Abstract
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
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Additional information
| Publication type | Technical Report |
|---|---|
| Publication date | 2022-06-17 |
| Edition | 1.0 |
| Available language(s) | English |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.190 - Electronic component assemblies |
| Stability date | 2027 |
| Pages | 26 |
| File size | 2318 KB |
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