IEC Technical Report 61760-3-1
IEC TR 61760-3-1:2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
CHFÂ 200.-
Technical committee
TC 91 Electronics assembly technology| Publication type | Technical Report |
| Publication date | 2022-06-17 |
| Edition | 1.0 |
| ICS | 31.190 |
| Stability date | 2027 |
| ISBN number | 9782832239285 |
| Pages | 26 |
| File size | 2.21 MB |
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