IEC 62374-1
IEC 62374-1:2010
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
CHFÂ 80.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2010-09-29 |
| Edition | 1.0 |
| ICS | 31.080.99 |
| Stability date | 2031 |
| ISBN number | 9782889121786 |
| Pages | 32 |
| File size | 1.05 MB |
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