IEC 62418
IEC 62418:2010
Semiconductor devices - Metallization stress void test
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
CHFÂ 115.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2010-04-22 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2031 |
| ISBN number | 9782889106974 |
| Pages | 34 |
| File size | 1001.40 KB |
Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation