IEC TR 62453-502:2009 Withdrawn
Field device tool (FDT) interface specification - Part 502: Communication implementation for common object model - IEC 61784 CPF 2
Note: this publication has been replaced by IEC TR 62453-51-20:2017
Abstract
IEC/TR 62453-502:2009(E) is a technical report and provides information for integrating the CIP technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5). Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM), also based on CIPTM, is defined in [13]. It neither contains the FDT specification nor modifies it.
Additional information
Publication type | Technical Report |
---|---|
Publication date | 2009-08-18 |
Withdrawal date | 2017-06-15 |
Edition | 1.0 |
Available language(s) | English |
TC/SC | TC 65/SC 65E - Devices and integration in enterprise systemsrss |
ICS | 25.040.40 - Industrial process measurement and control 35.100.05 - Multilayer applications 35.110 - Networking |
Stability date | 2017 |
Pages | 22 |
File size | 1460 KB |
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