IEC Technical Report 61760-5-1
IEC TR 61760-5-1:2024
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.
CHF 155.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | Technical Report |
| Publication date | 2024-01-31 |
| Edition | 1.0 |
| ICS | 31.190 |
| Stability date | 2028 |
| ISBN number | 9782832281604 |
| Pages | 24 |
| File size | 4.51 MB |
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