IEC 61189-2-501:2021 PRV 
Pre release version

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

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Abstract

This Final Draft International Standard is an up to 6 weeks' pre-release of the official publication. It is available for sale during its voting period: 2021-10-29 to 2021-12-10. By purchasing this FDIS now, you will automatically receive, in addition, the final publication.

IEC 61189-2-501:2021 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

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Additional information

Publication typeInternational Standard
Publication date2021-10-29
Edition1.0
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
Stability date  2026
Pages16
File size1893 KB

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