IEC TS 62647-2:2012 

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

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Abstract

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.

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Additional information

Publication typeTechnical Specification
Publication date2012-11-29
Edition1.0
Available language(s)English
TC/SCTC 107 - Process management for avionicsrss
ICS03.100.50 - Production. Production management
31.020 - Electronic components in general
49.060 - Aerospace electric equipment and systems
Stability date  2020
Pages68
File size5486 KB

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