IEC TR 62866:2014 

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

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Abstract

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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Additional information

Publication typeTechnical Report
Publication date2014-05-07
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
Stability date  2020
Pages187
File size4838 KB

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