IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
Abstract
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
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Additional information
| Publication type | Technical Report |
|---|---|
| Publication date | 2014-05-07 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2023 |
| Pages | 187 |
| File size | 4838 KB |
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