IEC 63378-2-1
IEC 63378-2-1:2024
Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
CHFÂ 80.-
Technical committee
TC 47/SC 47D Semiconductor devices packaging| Publication type | International Standard |
| Publication date | 2024-10-22 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2028 |
| ISBN number | 9782832298169 |
| Pages | 15 |
| File size | 1.12 MB |
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