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IEC Technical Report 60068-3-15

IEC TR 60068-3-15:2024
Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
IEC TR 60068-3-15:2024 describes vacuum-assisted soldering considering the thermal profiling, soldering methods, suitability of the components and vacuum features of soldering systems. It is based on practical experiences from manufacturers, component, material, and soldering systems suppliers. It supports manufacturers by providing information about the functionality of vacuum and effect of vacuum on components performance.
BASE PUBLICATION
English
  CHF 200.-

Technical committee

TC 91 Electronics assembly technology

Category

Quality Assurance
Publication typeTechnical Report
Publication date2024-02-06
Edition1.0
ICS

19.040

31.190

Stability date2028
ISBN number9782832281697
Pages27
File size5.23 MB
EditionDatePublicationEditionStatus
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