IEC Technical Report 60068-3-15
IEC TR 60068-3-15:2024
Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
IEC TR 60068-3-15:2024 describes vacuum-assisted soldering considering the thermal profiling, soldering methods, suitability of the components and vacuum features of soldering systems. It is based on practical experiences from manufacturers, component, material, and soldering systems suppliers. It supports manufacturers by providing information about the functionality of vacuum and effect of vacuum on components performance.
CHFÂ 200.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality AssurancePublication type | Technical Report |
Publication date | 2024-02-06 |
Edition | 1.0 |
ICS | 19.040 31.190 |
Stability date | 2028 |
ISBN number | 9782832281697 |
Pages | 27 |
File size | 5.23 MB |
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