IEC 63251:2023 PRV 
Pre release version

Test method for mechanical property of flexible opto-electric circuit boards under thermal stress


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This Final Draft International Standard is an up to 6 weeks' pre-release of the official publication. It is available for sale during its voting period: 2023-08-25 to 2023-10-06. By purchasing this FDIS now, you will automatically receive, in addition, the final publication.

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

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Additional information

Publication typeInternational Standard
Publication date2023-08-25
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
Stability date  2028
File size3340 KB

The following test report forms are related:

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