IEC 63251:2023 PRV
Pre release version
Test method for mechanical property of flexible opto-electric circuit boards under thermal stress
Abstract
This Final Draft International Standard is an up to 6 weeks' pre-release of the official publication. It is available for sale during its voting period: 2023-08-25 to 2023-10-06. By purchasing this FDIS now, you will automatically receive, in addition, the final publication.
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2023-08-25 |
| Edition | 1.0 |
| Available language(s) | English |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2028 |
| Pages | 21 |
| File size | 3340 KB |
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