IEC 63251:2023 PRV
Pre release version
Test method for mechanical property of flexible opto-electric circuit boards under thermal stress
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
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