IEC 60191-5:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
Abstract
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
Additional information
Publication type | International Standard |
---|---|
Publication date | 1997-04-23 |
Edition | 2.0 |
Available language(s) | English/French |
TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2027 |
Pages | 71 |
File size | 558 KB |
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