IEC 60191-6-13:2007 Withdrawn

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

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Abstract

IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

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Additional information

Publication typeInternational Standard
Publication date2007-06-27
Edition1.0
Available language(s)English, English/French
TC/SCTC 47/SC 47D - Semiconductor devices packagingrss
ICS31.080.01 - Semiconductor devices in general
Pages29
File size1096 KB

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