Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
|Publication type||International Standard|
|TC/SC||TC 47/SC 47D - Semiconductor devices packagingrss|
|ICS||31.080.01 - Semiconductor devices in general|
|File size||1344 KB|
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