IEC 61760-4:2015
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Note: a more recent version of this publication exists
IEC 61760-4:2015+AMD1:2018 CSV
Abstract
IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2015-05-19 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.190 - Electronic component assemblies |
Stability date | 2025 |
Pages | 66 |
File size | 1437 KB |
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