IEC 61191-2:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Abstract
IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.
Look inside
Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2017-05-23 |
| Edition | 3.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.190 - Electronic component assemblies
31.240 - Mechanical structures for electronic equipment |
| Stability date | 2025 |
| Pages | 66 |
| File size | 2134 KB |
The following test report forms are related:
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