IEC 61191-3:2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Abstract
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2017-05-30 |
| Edition | 2.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.240 - Mechanical structures for electronic equipment |
| Stability date | 2025 |
| Pages | 40 |
| File size | 1368 KB |
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