IEC 60191-6-20:2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Abstract
IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2010-08-30 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2027 |
Pages | 21 |
File size | 1168 KB |
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