IEC 60191-6-8:2001 

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)


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IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

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Additional information

Publication typeInternational Standard
Publication date2001-08-27
Available language(s)English, English/French, Spanish
TC/SCTC 47/SC 47D - Semiconductor devices packagingrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2020
File size1022 KB

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