IEC 60749-21:2004 Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Abstract
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2004-03-15 |
Withdrawal date | 2011-04-07 |
Edition | 1.0 |
Available language(s) | English, English/French |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2011 |
Pages | 45 |
File size | 1263 KB |
The following test report forms are related:
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