IEC 63055:2016 Withdrawn

Format for LSI-Package-Board Interoperable design


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IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

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Additional information

Publication typeInternational Standard
Publication date2016-11-08
Withdrawal date2023-10-11
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
31.200 - Integrated circuits. Microelectronics
35.060 - Languages used in information technology
Stability date  2023
File size8869 KB

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